W957D6HBCX7I TR

W957D6HB 128Mb Async./Burst/Sync./A/D MUX TABLE OF CONTENTS 1. GENERAL DESCRIPTION .......................................................................................................... 3 2. FEATURES.................................................................................................................................. 3 3. ORDERING INFORMATION ....................................................................................................... 3 4. PIN CONFIGURATION ................................................................................................................ 4 4.1 Ball Assignment ............................................................................................................................... 4 5. PIN DESCRIPTION ..................................................................................................................... 5 5.1 Signal Description ............................................................................................................................ 5 6. BLOCK DIAGRAM ...................................................................................................................... 6 7. INSTRUCTION SET .................................................................................................................... 7 7.1 Bus Operation .................................................................................................................................. 7 8. FUNCTIONAL DESCRIPTION .................................................................................................... 8 8.1 Power Up Initialization ..................................................................................................................... 8 8.1.1 Power-Up Initialization Timing ................................................................................................................... 8 8.2 Bus Operating Modes ...................................................................................................................... 8 8.2.1 Asynchronous Modes ................................................................................................................................ 8 8.2.1.1 READ Operation (ADV# LOW)......................................................................................................................... 9 8.2.1.2 WRITE Operation (ADV# LOW) ....................................................................................................................... 9 8.2.2 Burst Mode Operation.............................................................................................................................. 10 8.2.2.1 Burst Mode READ (4-word burst) ................................................................................................................... 10 8.2.2.2 Burst Mode WRITE (4-word burst) ................................................................................................................. 11 8.2.2.3 Refresh Collision During Variable-Latency READ Operation ......................................................................... 12 8.2.3 Mixed-Mode Operation ............................................................................................................................ 13 8.2.4 WAIT Operation ....................................................................................................................................... 13 8.2.4.1 Wired-OR WAIT Configuration ....................................................................................................................... 13 8.2.5 LB#/ UB# Operation................................................................................................................................. 14 8.3 Low Power Operation .................................................................................................................... 14 8.3.1 Standby Mode Operation ......................................................................................................................... 14 8.3.2 Temperature Compensated Refresh ....................................................................................................... 14 8.3.3 Partial-Array Refresh ............................................................................................................................... 14 8.3.4 Deep Power-Down Operation .................................................................................................................. 14 8.4 Registers ....................................................................................................................................... 15 8.4.1 Access Using CRE .................................................................................................................................. 15 8.4.1.1 Configuration Register WRITE Asynchronous Mode Followed by READ Operation ...................................... 15 8.4.1.2 Configuration Register WRITE Synchronous Mode Followed by READ Operation ........................................ 16 8.4.1.3 Configuration Register READ Asynchronous Mode Followed by READ ARRAY Operation ........................... 17 8.4.1.4 Configuration Register READ Synchronous Mode Followed by READ ARRAY Operation ............................ 18 8.4.2 Software Access ...................................................................................................................................... 19 8.4.2.1 Load Configuration Register ........................................................................................................................... 19 8.4.2.2 Read Configuration Register .......................................................................................................................... 20 8.4.3 Bus Configuration Register ...................................................................................................................... 20 8.4.3.1 Bus Configuration Register Definition ............................................................................................................ 21 8.4.3.2 Burst Length (BCR[2:0]) Default = Continuous Burst ..................................................................................... 22 8.4.3.3 Burst Wrap (BCR[3]) Default = No Wrap ........................................................................................................ 22 8.4.3.4 Sequence and Burst Length ........................................................................................................................... 23 8.4.3.5 Drive Strength (BCR[5:4]) Default = Outputs Use Half-Drive Strength ........................................................... 24 8.4.3.6 Table of Drive Strength ................................................................................................................................... 24 8.4.3.7 WAIT Configuration. (BCR[8]) ........................................................................................................................ 24 8.4.3.8 WAIT Polarity (BCR[10])................................................................................................................................. 24 8.4.3.9 WAIT Configuration During Burst Operation ................................................................................................... 25 8.4.3.10 Latency Counter (BCR[13:11]) Default = Three Clock Latency .................................................................... 25 8.4.3.11 Initial Access Latency (BCR[14]) Default = Variable ..................................................................................... 25 8.4.3.12 Allowed Latency Counter Settings in Variable Latency Mode ....................................................................... 25 Publication Release Date: Aug. 17, 2016 Revision: A01-005 -1- W957D6HB 8.4.3.13 Latency Counter (Variable Initial Latency, No Refresh Collision) .................................................................. 26 8.4.3.14 Allowed Latency Counter Settings in Fixed Latency Mode ........................................................................... 26 8.4.3.15 Latency Counter (Fixed Latency) ................................................................................................................. 27 8.4.3.16 Operating Mode (BCR[15]) ........................................................................................................................... 27 8.4.4 Refresh Configuration Register ............................................................................................................... 28 8.4.4.1 Refresh Configuration Register Mapping ....................................................................................................... 28 8.4.4.2 Partial Array Refresh (RCR[2:0]) Default = Full Array Refresh ....................................................................... 28 8.4.4.3 Address Patterns for PAR (RCR [4] = 1)......................................................................................................... 29 8.4.4.4 Deep Power-Down (RCR[4]) Default = DPD Disabled ................................................................................... 29 8.4.5 Device Identification Register .................................................................................................................. 29 8.4.5.1 Device Identification Register Mapping .......................................................................................................... 29 9. ELECTRICAL CHARACTERISTIC ........................................................................................... 30 9.1 Absolute Maximum DC, AC Ratings .............................................................................................. 30 9.2 Electrical Characteristics and Operating Conditions ....................................................................... 30 9.3 Deep Power-Down Specifications .................................................................................................. 31 9.4 Partial Array Self Refresh Standby Current .................................................................................... 31 9.5 Capacitance ................................................................................................................................... 31 9.6 AC Input-Output Reference Wave form.......................................................................................... 31 9.7 AC Output Load Circuit .................................................................................................................. 31 10. TIMING REQUIRMENTS ......................................................................................................... 32 10.1 Read, Write Timing Requirements ............................................................................................... 32 10.1.1 Asynchronous READ Cycle Timing Requirements ............................................................................... 32 10.1.2 Burst READ Cycle Timing Requirements .............................................................................................. 33 10.1.3 Asynchronous WRITE Cycle Timing Requirements .............................................................................. 34 10.1.4 Burst WRITE Cycle Timing Requirements ............................................................................................ 35 10.2 TIMING DIAGRAMS .................................................................................................................... 36 10.2.1 Initialization Period................................................................................................................................. 36 10.2.2 DPD Entry and Exit Timing Parameters ................................................................................................ 36 10.2.3 Initialization and DPD Timing Parameters ............................................................................................. 36 10.2.4 Asynchronous READ ............................................................................................................................. 37 10.2.5 Single Access Burst READ Operation - Variable Latency..................................................................... 38 10.2.6 Four Word Burst READ Operation-Variable Latency ............................................................................ 39 10.2.7 Single-Access Burst READ Operation-Fixed Latency ........................................................................... 40 10.2.8 Four Word Burst READ Operation-Fixed Latency ................................................................................. 41 10.2.9 Burst READ Terminate at End-of-Row (Wrap Off) ................................................................................ 42 10.2.10 Burst READ Row Boundary Crossing ................................................................................................. 43 10.2.11 Asynchronous WRITE ......................................................................................................................... 44 10.2.12 Burst WRITE Operation—Variable Latency Mode .............................................................................. 45 10.2.13 Burst WRITE Operation-Fixed Latency Mode ..................................................................................... 46 10.2.14 Burst WRITE Terminate at End of Row (Wrap Off) ............................................................................. 47 10.2.15 Burst WRITE Row Boundary Crossing ................................................................................................ 48 10.2.17 Asynchronous WRITE Followed by Burst READ ................................................................................ 50 10.2.18 Burst READ Followed by Asynchronous WRITE ................................................................................ 51 10.2.19 Asynchronous WRITE Followed by Asynchronous READ .................................................................. 52 11. PACKAGE DESCRIPTION ..................................................................................................... 53 11.1 Package Dimension ..................................................................................................................... 53 12. REVISION HISTORY ............................................................................................................... 54 Publication Release Date: Aug. 17, 2016 Revision: A01-005 -2- W957D6HB 1. GENERAL DESCRIPTION Winbond x16 ADMUX products are high-speed, CMOS pseudo-static random access memory developed for lowpower, portable applications. The device has a DRAM core organized. These devices are a variation of the industrystandard Flash control interface, with a multiplexed address/data bus. The multiplexed address and data functionality dramatically reduce the required signal count, and increase READ/WRITE bandwidth. For seamless operation on a burst Flash bus, Winbond x16 ADMUX products incorporate a transparent self-refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device READ/WRITE performance. Two user-accessible control registers define device operation. The bus configuration register (BCR) defines how the Winbond x16 ADMUX device interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh configuration register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up and can be updated anytime during normal operation. Special attention has been focused on standby current consumption during self refresh. Winbond x16 ADMUX products include two mechanisms to minimize standby current. Partial-array refresh (PAR) enables the system to limit refresh to only that part of the DRAM array that contains essential data. Temperature-compensated refresh (TCR) uses an on-chip sensor to adjust the refresh rate to match the device temperature—the refresh rate decreases at lower temperatures to minimize current consumption during standby. The system-configurable refresh mechanisms are accessed through the RCR. Winbond x16 ADMUX device is compliant with the industry-standard CellularRAM 1.5 x16 A/D MUX. 2. FEATURES • Supports asynchronous, page, and burst operations • Low-power features • VCC, VCCQ Voltages: On-chip temperature compensated refresh (TCR) 1.7V–1.95V VCC Partial array refresh (PAR) 1.7V–1.95V VCCQ Deep power-down (DPD) mode • Random access time: 70ns • Package: 54 Ball VFBGA • Burst mode READ and WRITE access: •16-bit multiplexed address/data bus •Operating temperature range: 4, 8, 16, or 32 words, or continuous burst -40°C ≤ TCASE ≤ 85°C Burst wrap or sequential  Max clock rate: 133 MHz (tCLK = 7.5ns) • Low power consumption: Asynchronous READ: 20ns. 4. CE# must go HIGH before any clock edge following the last word of a defined-length burst. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 46 - W957D6HB 10.2.14 Burst WRITE Terminate at End of Row (Wrap Off) CLK A[max:16] VIH VIL VIL ADV# VIH VIL LB#/UB# VIH VIL WE# OE# CE# tCLK VIH VIH VIL VIH VIL VIH Note 2 VIL tSP A/DQ[15:0] tCSP tHD VIH VIL tHD Valid Input Valid Input Valid Input END OF ROW tHZ tHZ VOH WAIT VOL HIGH-Z tKOH tKHTL Don't Care Undefined Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency, WAIT active LOW, WAIT asserted during delay (shown as solid line). 2. For burst WRITEs, CE# must go HIGH before the second CLK after the WAIT period begins (before the second CLK after WAIT asserts with BCR[8] = 0, or before the third CLK after WAIT asserts with BCR[8] = 1). Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 47 - W957D6HB 10.2.15 Burst WRITE Row Boundary Crossing CLK VIH VIL tCLK A[max:16] ADV# VIH VIL VIH VIL VIH LB#/UB# WE# VIL VIH VIL VIH OE# VIL CE# VIH VIL tSP A/DQ[15:0] VIH VIL End of row tHD Valid Input Valid Input Valid Input Valid Input tKHTL Valid Input tKHTL VOH WAIT VOL tKOH tKOH Note 2 Don't Care Undefined Notes: 1. Non-default BCR settings for burst WRITE at end of row: fixed or variable latency, WAIT active LOW, WAIT asserted during delay (shown as solid line). 2. WAIT will be asserted LC cycles for variable latency or fixed latency. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 48 - W957D6HB 10.2.16 Burst WRITE Followed by Burst READ tCLK CLK A[max:16] VIH VIL tSP tHD tSP tHD Valid Address Valid Valid Address Address VIH VIL tHD ADV# VIH VIL tSP tSP tHD tHD tSP VIH LB#/UB# VIL tCSP CE# tHD tCBPH VIH Note 2 VIL tCSP tOHZ VIH OE# tHD VIL WE# VIH tSP tHD tSP VIL tSP A/DQ[15:0] IN/OUT VIH tSP tHD tSP tHD Valid D0 D1 D2 D3 output VIL tHD VOH WAIT Valid Address tKOH tBOE VOH VOL Valid Output Valid Output Valid Output Valid Output tACLK HIGH-Z HIGH-Z VOL Don't Care Undefined Notes: 1. Non-default BCR settings for burst WRITE followed by burst READ: fixed or variable latency, latency code 2 (3 clocks), WAIT active LOW, WAIT asserted during delay. 2. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 49 - W957D6HB 10.2.17 Asynchronous WRITE Followed by Burst READ tCLK CLK VIH VIL tSP A[max:16] VIH VIL ADV# VIH VIL LB#/UB# VIH VIL tAVS tAS tVP tAVH tSP tHD tAS tSP tBW tCBPH CE# VIH VIL tHD Valid Address Valid Address tHD tCSP tCW Note 2 OE# VIH VIL tWC tSP tHD tWP WE# VIH VIL tAS A/DQ[15:0] tOHZ VIH VIL Valid Address tAVS VOH WAIT VOL tBOE tSP tHD Data tAVH tDW Valid Address tDH tKHTL VOH Valid Output VOL tACLK Valid Output Valid Output Valid Output tKOH HIGH-Z Don't Care Undefined Notes: 1. Non-default BCR settings for asynchronous WRITE, with ADV# LOW, followed by burst READ: fixed or variable latency, latency code 2 (3 clocks), WAIT active LOW, WAIT asserted during delay. 2. When the device is transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when the device is transitioning to fixed-latency burst READs. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 50 - W957D6HB 10.2.18 Burst READ Followed by Asynchronous WRITE tCLK CLK VIH VIL A[max:16] VIH VIL tSP tHD Valid Address Valid Address tAVS tAVH tAW tAS tSP ADV# tHD tVS VIH tVP VIL tHD tCSP CE# tAS tCW VIH VIL Note 2 tOHZ tBOE OE# tCBPH tHZ VIH VIL tSP WE# VIH VIL LB#/UB# VIH VIL tOLZ tHD tWP tHD tSP tSP A/DQ[15:0] VIH VIL tHD VOH Valid Address Valid Output VOL tBW tAS tKOH tACLK tWPH tAVS VIH VIL tAVH Valid Address tDW tDH Valid Input tKOH VOH WAIT VOL HIGH-Z HIGH-Z tKHTL tKHTL READ burst identified (WE# = HIGH) Don't Care Undefined Notes: 1. Non-default BCR settings for burst READ followed by asynchronous WRITE using ADV#: fixed or variable latency, latency code 2 (3 clocks), WAIT active LOW, WAIT asserted during delay. 2. When the device is transitioning between asynchronous and variable-latency burst operations, CE# must go HIGH. CE# can stay LOW when the device is transitioning from fixed-latency burst READs; asynchronous operation begins at the falling edge of ADV#. A refresh opportunity must be provided every tCEM. A refresh opportunity is satisfied by either of the following two conditions: a) clocked CE# HIGH, or b) CE# HIGH for longer than 15ns. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 51 - W957D6HB 10.2.19 Asynchronous WRITE Followed by Asynchronous READ A[max:16] VIH Valid Address Valid Address VIL tAVS tAS tAVH tVS ADV# VIL tAA tAADV tAW tWR tVP VIH tAVH tAVS tVP tAS tBHZ tCVS LB#/UB# CE# VIH tBW tBA VIL tCVS VIH tCPH tHZ tCO tCW Note 1 VIL tOLZ OE# tOHZ tOE VIH VIL tWP WE# VIH VIL tAS VIH A/DQ[15:0] VIL Valid Address tAVS Valid Input tAVH tDW Valid Address tDH tAVS VOH Valid Output VOL tAVH tAA tAW tOEW WAIT VOH tHZ HIGH-Z VOL Don't Care Undefined Note: 1. When configured for synchronous mode (BCR[15] = 0), CE# must remain HIGH for at least 5ns (tCPH) to schedule the appropriate refresh interval. Otherwise, tCPH is only required after CE#-controlled WRITEs. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 52 - W957D6HB 11. PACKAGE DESCRIPTION 11.1 Package Dimension VFBGA 54Ball (6x8 mm2, Ball pitch: 0.75mm, Ø =0.4mm) 6 5 3 4 E1 2 1 A PIN A1 INDEX eE A1 // bbb PIN A1 INDEX E A eD B C D1 D D E F G H J Φb Φaaa Φddd ccc SEATING PLANE M M BALL LAND SYMBOL A A1 D D1 E E1 b aaa bbb ccc ddd eee e DIMENSION (mm) MIN. NOM. MAX. ----1.00 0.29 0.34 0.24 8.00 7.90 8.10 6.00 BSC. 6.00 5.90 6.10 3.75 BSC. 0.40 0.35 0.45 0.15 0.20 ----0.10 0.15 0.08 0.75 1 BALL OPENING Note: 1. Ball land: 0.45mm, Ball opening: 0.35mm, PCB Ball land suggested ≤ 0.35mm Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 53 - W957D6HB 12. REVISION HISTORY Version Date Page Description A01-001 Feb. 22, 2013 All A01-002 Mar. 26, 2013 2 1~38 Update ordering information Add DPD mode A01-003 May 09, 2013 All, 2 Update part # A01-004 Jun. 27, 2013 32 A01-005 All 8 34 52 Aug. 17, 2016 3, 19, 20, 25, 29, 36 31 43 48 Create new document Remove note 6 in section 9.2 Refine format Refine 8.1.1 power-up initialization timing diagram Removing redundant tWHZ parameter Correcting typo in 10.2.19 timing diagram (change tDS to tDW ) Correcting typos Defined 9.4 Partial Array Self Refresh standby current values Revise note2 of 10.2.10 Burst READ Row Boundary Crossing Revise note2 of 10.2.15 Burst WRITE Row Boundary Crossing Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation where in personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales. Publication Release Date: Aug. 17, 2016 Revision: A01-005 - 54 -